IZMO successfully designs 3D System-in-Package (SiP) module for Space Payload Camera Electronics

IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
pv magazine USA

Researchers achieve record perovskite solar module stability under light, heat, and UV stress

An international research team has developed a new two-dimensional perovskite interlayer based on a co-crystal engineering strategy for more robust perovskite films. It demonstrated improved ...
Electronic Design

Module Integrates 3D Time-of-Flight Sensor

In the video, Erik Barnes shows off the power-efficient, 1-Mpixel, 3D TOF sensor in the company's eval module. The module is built into a custom, handheld capture system. The ADTF3175 chip has 1k × 1k ...
SlashGear

Sharp 3D Camera Module Unveiled: Headed To Nintendo 3DS?

Sharp are already tipped to be among the companies Nintendo is considering for the 2D/3D display on the upcoming Nintendo 3DS; how interesting would it be if they also supplied the handheld with a ...