Samsung has signed an agreement with China’s YMTC to use its bonding technology in the production of 400-layer NAND flash ...

Workarounds include stacking more layers on top of each other (3D NAND) and increasing the number of voltage levels – and thus bits – within an individual cell. Although this has boosted the ...

South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND. YMTC continues ...

It focuses on 3D NAND flash memory, a critical component in storage devices like SSDs, smartphones, and data centers, and most famously developed Xtacking technology, a proprietary architecture ...

According to Tai Wei,... Wednesday 26 February 2025 YMTC's hybrid bonding patents: is Samsung losing ground in 400+ layer 3D NAND? South Korea's NAND flash leaders, Samsung and SK Hynix ...

Leveraging this unique high-speed technology, the companies expect the new 3D flash memory to achieve a 33 percent improvement in NAND interface speed compared with their 8th generation 3D flash ...

According to industry sources on the 24th, Samsung Electronics has reportedly signed a 'hybrid bonding' license agreement with YMTC for three-dimensional (3D) NAND manufacturing. Hybrid bonding is ...

It focuses on 3D NAND flash memory, a critical component in storage devices like SSDs, smartphones, and data centers, and most famously developed Xtacking technology, a proprietary architecture ...

SAN FRANCISCO — Kioxia Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4.8Gb/s NAND interface speed, superior ...