Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs ...

Micron's HBM revenue surged, but shares fell amid tariff challenges. Check out MU stock's key insights on valuation, AI ...

The recent HBM4 specification announced by JEDEC is great news for developers of AI training hardware. HBM4 is the latest specification in the rapidly evolving High Bandwidth Memory (HBM) DRAM ...

OKI Circuit Technology ("OTC"; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit ...

Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification progress is once ...

JEDEC Solid State Technology Association, developer of standards for the microelectronics industry, today announced the ...

Marvell Technology, Inc (MRVL) announces successful interoperability of its CXL devices with AMD and Intel platforms.

Cadence Design Systems, Inc. CDNS recently launched the industry’s first DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution, designed on the advanced TSMC N3 process node. This leading-edge ...

“We are excited to see the progress and collaboration in this community.” “High-performance, high-bandwidth memory (HBM) solutions are the foundation of AI’s continuous growth. HBM4 has ...

The advancements introduced by HBM4 are vital for applications that require efficient handling of large datasets and complex calculations, including generative artificial intelligence (AI), ...