Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

India’s first commercially packaged multi-chip module (MCM) was rolled out of Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand in the wee hours of Wednesday and ...

Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...

Fairchild Semiconductor's FDMF6700 is an optimized and integrated FET-plus-driver power stage in a 6-mm x 6-mm MLP package. Fairchild Semiconductor’s FDMF6700 is an optimized and integrated ...

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...

MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...

NeoGene Tech, a Guangzhou-based Taiwanese thermal management solution provider, has in Q3 2022 supported Xiaomi to successfully launch its flagship 5G smartphone, Xiaomi 12S Ultra, with excellent ...

The issue of MEMS-based system solutions and their packaging will be addressed at the MEMS Industry Group’s annual MEMS Executive Congress, which will be held in Scottsdale AZ on November 3-5, 2010, ...