Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Key HBM Gen2 PHY product highlights include support for DRAM 2, 4 and 8 stack height ... Additional features include a flexible delivery of the IP core (works with ASIC/ SoC layout requirements), 8 ...

Over the last decade HBM2 and HBM3 standards have been released with improvements in frequency of operation and DRAM stack height/capacity. The HBM standard released in 2013 specified 1 Gbps (Giga bit ...

Rumor mill: The DRAM industry could be in for a major shake ... shifting focus toward DDR5 and high-bandwidth memory (HBM) products for the foreseeable future. Halting production of older memory ...

It seems that Wall Street is assuming that memory cycle has already peaked. Memory Cycle hasn't peaked yet due to ramp up of ...

High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, ...

Micron specializes in DRAM, NAND, and emerging memory technologies such as High Bandwidth (NASDAQ:BAND) Memory (HBM). The company has recently demonstrated resilience in a challenging market ...

As AI applications advance, the demand for high-performance and energy-efficient memory is growing across on-device AI, high-performance computing (HPC), and data centers. In response, Samsung ...

However, DRAM probe-card revenue reached a third consecutive quarterly record, driven by high demand for DDR5 and HBM technologies. The company highlighted the acquisition of a 20% stake in FICT ...

TL;DR: Samsung Electronics plans to launch its next-generation low-power wide I/O (LPW) DRAM, also known as low-latency wide I/O (LLW), in 2028. This "mobile HBM" memory aims to enhance on-device ...