The TC bonder, a crucial tool in the HBM manufacturing process, is used to stack chips vertically. SK hynix’s method involves ...

Planned to enter production in 2028, current A14 development is progressing smoothly with yield performance ahead of schedule ...

Micron Technology, long the third-largest player in the global memory chip market behind Samsung Electronics and SK hynix, is ...

"The samples were delivered ahead of schedule based on SK hynix's technological edge and production experience that have led the HBM market, and the company is to start the certification process ...

South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation ...

Computing accelerators grow more complex with multi-chip designs. TSMC plans to stack logic chips while integrating power ...

This new fab will incorporate front-end and back-end process capabilities required for HBM production. SK hynix should have production capacity of HBM increased to 160,000 to 170,000 units per ...

OKI Circuit Technology ("OTC"; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit ...