GB300 'Blackwell Ultra' with 288GB HBM3E, increased 1.4kW power to be detailed, Rubin AI GPU details and CPO tech unveiling.

Sandisk has unveiled High Bandwidth Flash (HBF) for AI workloads which will have a major impact on the $100 billion HBM market.

Indeed, despite being flash-based, HBF reportedly matches HBM in raw throughput ... to pack multiple terabytes of high-bandwidth memory into a GPU could reshape AI processing as we know it.

It seems that Wall Street is assuming that memory cycle has already peaked. Memory Cycle hasn't peaked yet due to ramp up of ...

Advanced packaging technologies, such as 2.5D and 3D integration, allow for the stacking of memory and logic chips. Stacking ...

Large language models would thus fit on a GPU. High-bandwidth memory (HBM) has competition. The NAND flash manufacturer Sandisk is proposing the memory form High-Bandwidth Flash (HBF) for AI ...

High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, ...

Micron is preparing for the mass production of its new 12-Hi HBM3E memory, ready to supply its new AI memory to NVIDIA to use on its AI GPUs ... that most of the HBM produced in 2H 2025 would ...

The first-generation HBF can enable up to 4TB of VRAM capacity on a GPU, and more capacity in future ... "We are calling it the HBF technology to augment HBM memory for AI inference workloads ...

SEOUL, March 12 (Yonhap) -- Chip giants Samsung Electronics Co. and SK hynix Inc. will showcase their latest advancements in ...