Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.
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A $100bn tech company you've probably never heard of is teaming up with the world's biggest memory manufacturers to produce supercharged HBMBy optimizing the interfaces between AI compute silicon dies and High Bandwidth Memory stacks, Marvell claims the technology reduces power consumption by up to 70% compared to standard HBM ...
Advanced packaging technologies, such as 2.5D and 3D integration, allow for the stacking of memory and logic chips. Stacking ...
It seems that Wall Street is assuming that memory cycle has already peaked. Memory Cycle hasn't peaked yet due to ramp up of ...
As competition intensifies in the development of large language models and with the launch of DeepSeek, the industry is ...
Rambus recently announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the ...
This "mobile HBM" memory aims to enhance on-device AI with improved performance and reduced power consumption. Samsung Electronics is reportedly set to introduce its next-generation mobile memory ...
Micron Technology (MU) aims to bolster its position in the high-bandwidth memory (HBM) market. The company plans to ramp up production of its 12-stack HBM3E memory and supply it to its key ...
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