GB300 'Blackwell Ultra' with 288GB HBM3E, increased 1.4kW power to be detailed, Rubin AI GPU details and CPO tech unveiling.

High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, ...

including Nvidia. The chip is being produced using TSMC’s advanced 3-nanometer process and will feature a commonly used systolic array architecture, HBM, and advanced networking capabilities.

A leaked shipping manifest suggests NVIDIA is close to launching a new generation of professional graphics cards.

While the processors NVIDIA makes have been the hottest ... advanced graphics processors used in AI workloads. HBM helps "solve" for the GDDR bottleneck by stacking memory chips that have ultra ...

Used with the GPUs designed for AI training and other high-performance applications, high bandwidth memory (HBM) uses a 3D stacked architecture of DRAM (dynamic RAM) modules. In time, high ...

Recent industry reports reveal that Micron is preparing to begin mass production of its 12-layer HBM3E memory for Nvidia ... 12-layer products will dominate HBM production by late 2025.

November 29, 2023-- TrendForce’s latest research into the HBM market indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. Samsung’s HBM3 ...

including Nvidia. The chip is being produced using TSMC’s advanced 3-nanometer process and will feature a commonly used systolic array architecture, HBM, and advanced networking capabilities.

The H200 features 141GB of HBM3e and a 4.8 TB/s memory bandwidth, a substantial step up from Nvidia’s flagship H100 ... Intel, too, plans to ramp up the HBM capacity of its Gaudi AI chip ...

NVIDIA's new RTX PRO 6000 X Blackwell workstation card spotted in new shipping manifest: GB202 GPU, 96GB of GDDR7 memory, and ...