Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Sandisk has unveiled High Bandwidth Flash (HBF) for AI workloads which will have a major impact on the $100 billion HBM market.

Advanced packaging technologies, such as 2.5D and 3D integration, allow for the stacking of memory and logic chips. Stacking ...

Together, Pliops and the vLLM Production Stack, an open-source reference implementation of a cluster-wide full-stack vLLM serving system, are delivering unparalleled performance and efficiency for LLM ...

This results in HBF packing 8 to 16 times more capacity per stack than today's HBM implementations. In one of SanDisk's examples, a system rocking eight HBF stacks could provide a monstrous 4 ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND ... density—between 8x and 16x the capacity of current HBM solutions—as well as impressive throughput. Indeed, despite being ...

Micron completed the development of its 12-stack HBM in September 2024 and, since then, has been showcasing samples to NVIDIA and other potential customers. Micron’s Chief Financial Officer, Mark ...

Marvell Technology has demonstrated its first 2-nm silicon IP, enhancing the performance and efficiency of AI and cloud ...

Key HBM Gen2 PHY product highlights include support for DRAM 2, 4 and 8 stack height, a DFI-style interface to the memory controller, 2.5D interposer connections between the PHY and DRAM, a validated ...

Micron Technology (MU) aims to bolster its position in the high-bandwidth memory (HBM) market. The company plans to ramp up production of its 12-stack HBM3E memory and supply it to its key ...

The entire stack sits on an interposer atop a package substrate, similar to the packaging design used in HBM. HBF isn’t a straight drop-in replacement for HBM, but it does share the same ...