where he led the development of Through-Silicon Via (TSV)-based 3D packaging technologies. That work would later become the foundation for developing HBM. HBM is a type of high-performance memory ...

High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...

Hudbay (TSX: HBM) (NYSE: HBM) is a copper-focused critical minerals company with three long-life mining operations and a world-class pipeline of copper growth projects in tier-one mining ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

An executive of SK hynix said Thursday the firm will cooperate with Advanced Micro Devices (AMD) of the United States to supply highly-advanced chips for data-intensive mobile devices.

Micron Technology, the Fortune 500 memory chipmaker, is breaking ground on a new high-bandwidth memory (HBM) packaging facility in Singapore. The company expects operations to begin next year with ...