Semiconductor Engineering2d
Speeding Down Memory Lane With Custom HBM
Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.
A GPU or a CPU with 4TB HBM-class memory? Nope, you're not dreaming, Sandisk is working on such a monstrous product
Sandisk has unveiled High Bandwidth Flash (HBF) for AI workloads which will have a major impact on the $100 billion HBM market.
Semiconductor Engineering2y
Advanced Packaging for High-Bandwidth Memory: Influences of TSV size, TSV Aspect Ratio And Annealing Temperature
A technical paper titled “Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications” was published by researchers at National Yang Ming Chiao Tung University. “The ...
Hosted on MSN2mon
Micron wants a bigger slice of the $100 billion HBM market with its 2026-bound HBM4 and HBM4E memory solutions
Our TAM forecast for HBM in 2030 would be bigger than the size of the entire DRAM industry, including HBM, in calendar 2024." Expressing excitement about its next generation HBM, Mehrotra added ...
Design-Reuse8y
Design Considerations for High Bandwidth Memory Controller
High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...