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Fundamentally, the DDR5 — which is the latest generation of DRAM technology — is currently in an upgrade cycle. As such, ...
Future AI accelerators for China will not use the Hopper architecture, as Jensen Huang hints at a potential switch to ...
The company compares its 3D X-DRAM density to the current 0a-node planar DRAM’s 48GB and claims to reach 512GB, but the ...
Montage Technology is a global fabless semiconductor design company specializing in data processing and interconnect chip ...
Check out the most interesting AI chips announced at Computex 2025, including breakthroughs from Nvidia, MediaTek, Intel, and ...
NVIDIA has announced that its upcoming high-end architecture will no longer be based on its Hopper series. This decision ...
Rambus recently announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the ...
Addressing the growing use of AI and high-performance computing, JEDEC has published a new high-bandwidth memory (HBM) DRAM standard: HBM4. It aims to improve the performance, efficiency, and ...
Apple is believed to be developing several technological innovations to mark the 20th anniversary of the iPhone, and one key technology it's considering is Mobile High Bandwidth Memory (HBM ...