SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

The HBM space is currently dominated by South Korean memory giant SK Hynix and its chief rival (and neighbor) Samsung, ...

Among these, high bandwidth memory market stands out for its capacity ... striking a balance between speed and capacity. However, the performance story goes well beyond HBM2E, as HBM3 offers ...

Sandisk wants to pack an extremely large amount of fast flash memory onto GPU accelerators. Large language models would thus ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced the T5801 Ultra-High-Speed DRAM Test System. The cutting-edge platform is engineered to support the ...

Advantest has introduced the T5801 Ultra-High-Speed DRAM Test System. The cutting-edge platform is engineered to support the ...

GDDR: High-speed memory for AI inference Graphics Double Data Rate (GDDR) memory is traditionally associated with GPUs, but its high bandwidth and low latency make it an excellent choice for AI ...

Among these, high bandwidth memory market stands out for its capacity to deliver ... striking a balance between speed and capacity. However, the performance story goes well beyond HBM2E, as HBM3 ...