SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

New Delhi, Jan. 31, 2025 (GLOBE NEWSWIRE) -- The global high bandwidth memory market was valued at US$ 501.0 million in 2024 and is expected to reach US$ 5,810.5 million by 2033, at a CAGR of 31.3 ...

Editor’s Note: Sign up for CNN’s Meanwhile in China newsletter which explores what you need to know about the country’s rise and how it impacts the world. The US government has imposed fresh ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

This blog explores three leading memory solutions—HBM, LPDDR, and GDDR—and their suitability for AI accelerators. High Bandwidth Memory (HBM): The ultimate choice for AI training Generative AI and ...

Chinese AI startup DeepSeek has demonstrated a cost-effective approach to high-performance AI, potentially disrupting SK ...

Rambus recently announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the ...

Advantest has introduced the T5801 Ultra-High-Speed DRAM Test System. The cutting-edge platform is engineered to support the ...

The shares have since recovered to trade down 0.2% at midday. SK's factory investment plan for high-bandwidth memory (HBM) chips this year also underwhelmed investors, analysts said. Before the ...

New Delhi, Jan. 31, 2025 (GLOBE NEWSWIRE) -- The global high bandwidth memory market was valued at US$ 501.0 million in 2024 and is expected to reach US$ 5,810.5 million by 2033, at a CAGR of 31.3% ...