JEDEC has published the official HBM4 (High Bandwidth Memory 4) specification under JESD238, a new memory standard aimed at keeping up with the rapidly growing requirements of AI workloads, high ...

A high-speed interface for memory chips adopted by JEDEC in 2013. Used with the GPUs designed for AI training and other high-performance applications, high bandwidth memory (HBM) uses a 3D stacked ...

This will provide for a higher cube density of 64GB (32Gb 16-High). AI “High performance computing platforms are evolving rapidly and require innovation in memory bandwidth and capacity,” said Barry ...

High Bandwidth Memory (HBM) stands as one of the crucial components driving AI performance. Through the adoption of the HBM4 JEDEC Standard, this technology promises to deliver even higher ...

Capacity: HBM4 supports 4-high, 8-high, 12-high and 16-high DRAM stack configurations with 24 Gb or 32 Gb die densities, providing for a higher cube density of 64GB (32 Gb 16-High). “High performance ...

TL;DR: JEDEC has released the HBM4 DRAM standard, enhancing bandwidth up to 2 TB/s, doubling channels, and improving power efficiency and capacity for high-performance computing, AI, and graphics.

S anDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash ...

The rules apply to US-made high bandwidth memory (HBM) technology as well as foreign-produced ones, though some exceptions could be made. CNN values your feedback 1.

“High-bandwidth memory (HBM) production will be a headwind to industry bit supply growth,” Mehrotra said at a conference call recently. “HBM3E die is roughly twice the size of equivalent-capacity DDR5 ...

ARLINGTON, Va., April 16, 2025--JEDEC Solid State Technology Association, ... today announced the publication of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.