Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

SAN JOSE, Calif., Aug. 06, 2025 (GLOBE NEWSWIRE) -- Adeia Inc., a leading innovator in semiconductor 3D integration and advanced packaging technologies, is proud to announce that it has been presented ...

Nanoelectromechanical systems (NEMS) represent a transformative approach in the design of memory and logic devices, offering unprecedented energy efficiency and integration potential with standard ...