Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...
Westlake Village, Calif. — Diodes Inc. a leading manufacturer and supplier of high quality discrete semiconductors, today announced the introduction of the first in a series of planned ultra-miniature ...
KUALA LUMPUR, Malaysia--(BUSINESS WIRE)--Unisem today announced the introduction of a new high density leadframe packaging technology, the Leadframe Grid Array (LFGA). This latest offering, developed ...
The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications ...
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