Samsung - one of the creators of the 3D-stacked High Bandwidth Memory, or HBM - has launched its next innovation in that department with the introduction of its new processing-in-memory (PIM ...

High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, ...

According to industry sources, CXMT is investing in production facilities for HBM2, a second-generation HBM product first mass-produced by Samsung Electronics ... in-memory (PIM) and Compute ...

As AI applications advance, the demand for high-performance and energy-efficient memory is growing across on-device AI, high-performance computing (HPC), and data centers. In response, Samsung ...

The design of older HBM, like DRAM and NAND flash ... next-generation strategic businesses for Samsung Electronics and SK hynix. He explained, "PIM is ultimately customized DRAM, and it must ...

TL;DR: Samsung Electronics plans to launch its next-generation low-power wide I/O (LPW) DRAM, also known as low-latency wide I/O (LLW), in 2028. This "mobile HBM" memory aims to enhance on-device ...