IEEE7d
Wide-Field Kerr Microscopy and Magnetometry on Cr₂Ge₂Te₆ Exfoliated van-der-Waals Flakes
Abstract: The potential of wide-field magneto-optical Kerr microscopy for the characterisation of low-dimensional van-der-Waals crystals is explored using the example of Cr2Ge2Te6 flakes in the ten ...
IEEE29d
Physically-Based Simulations of Foam-Covered Ocean Emission at Microwave Frequencies
Abstract: An accurate sea foam emissivity model at microwave frequencies is indispensable for applications of microwave data in satellite data assimilation and remote sensing of atmospheric and ...
IEEE29d
Experimental Investigation of a Compact Lid-Compatible Multi-jet Impingement Manifold for Direct-On-Chip Cooling
Abstract: Multi-jet impingement-based cooling manifolds, functioning as integrated networks for liquid delivery and effusion, have become increasingly important due to the rising thermal management ...
IEEE3d
An Efficient Algorithm for Exploiting Multiple Arithmetic Units
Abstract: This paper describes the methods employed in the floating-point area of the System/360 Model 91 to exploit the existence of multiple execution units. Basic to these techniques is a simple ...
IEEE12d
Plotinus: A Satellite Internet Digital Twin System
Abstract: The development of space-air-ground integrated networks (SAGIN) requires sophisticated satellite Internet emulation tools that can handle complex, dynamic topologies and offer in-depth ...
IEEE11d
High Power Multi-Junction 808 nm Vertical Cavity Surface Emitting Lasers With High Efficiency
Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=68 ...
IEEE11d
Plasmon-Enhanced Performance in Self-Powered Solar-Blind CuCrO
Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=7361 ...
IEEE11d
FBG Accelerometer With High Figure of Merit Based on Double Short Gratings
Persistent Link: https://ieeexplore.ieee.org/servlet/opac?punumber=7361 ...
IEEE1mon
High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions
Abstract: The demand for chiplet integration using 2.5D and 3D advanced packaging technologies has surged, driven by the exponential growth in computing performance required by Artificial Intelligence ...
IEEE1mon
A Novel Electrostatic Comb Actuator Based on Self-Excited Oscillation for Insect-Scale Microrobots
Abstract: The self-excited electrostatic actuator is a novel actuation scheme that utilizes the electrostatic force induced self-excited oscillation to convert the input dc signals to sustained ...
IEEE28d
Distributed Model Predictive Control of Connected and Automated Vehicles with Markov Packet Loss
Abstract: Communication packet loss is omnipresent and can disrupt state convergence and weaken system stability for connected and automated vehicles (CAVs). Research into communication packet loss ...
IEEE1mon
MWFormer: Multi-Weather Image Restoration Using Degradation-Aware Transformers
Abstract: Restoring images captured under adverse weather conditions is a fundamental task for many computer vision applications. However, most existing weather restoration approaches are only capable ...