Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Celestial AI Inc., a startup that develops optical technology for linking chips, has raised $250 million in funding at a $2.5 ...

Nonetheless, Huawei continues to acquire millions of Ascend 910B and Ascend 910C for its internal AI projects and external ...

TAIPEI (Taiwan News) — Global Unichip Corporation announced Thursday the first universal chiplet interconnect express ...

Davis Global Fund posted a strong return of +22.70% in 2024, substantially outperforming its MSCI ACWI (All Country World ...

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Davis International Fund posted a return of +21.58% in 2024, substantially outperforming its MSCI ACWI (All Country World ...

Samsung Electronics' potential collaboration with Baidu on advanced artificial intelligence (AI) chips may have been ...

SEOUL, March 12 (Yonhap) -- Chip giants Samsung Electronics Co. and SK hynix Inc. will showcase their latest advancements in ...

Comment With the exception of custom cloud silicon, like Google's TPUs or Amazon's Trainium ASICs, the vast majority of AI ...

Huawei has acquired over 2 million AI chips from TSMC using a shell company and supply chain breaches and has also stocked up ...