The company compares its 3D X-DRAM density to the current 0a-node planar DRAM’s 48GB and claims to reach 512GB, but the ...

Montage Technology is a global fabless semiconductor design company specializing in data processing and interconnect chip ...

T1C and 3T0C designs combine performance of DRAM with manufacturability of NAND, enabling cost-effective, high-yield ...

Computex AMD aims to extend its lead over Intel in the high-end desktop (HEDT) and workstation arenas with its 9000-series ...

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible ...

in-memory computing, and next-gen DRAM and HBM applications; proof-of-concept test chips expected in 2026 Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026 ...

Expedera launches its Origin Evolution NPU IP, bringing hardware acceleration to meet the computational demands of running ...

These innovations underscore Silicon Motion's leadership in designing flexible, energy-efficient, high-performance SSD solutions for AI PCs, gaming systems, and portable devices. One of the key ...