Nonetheless, Huawei continues to acquire millions of Ascend 910B and Ascend 910C for its internal AI projects and external ...

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, ...

Samsung Electronics' potential collaboration with Baidu on advanced artificial intelligence (AI) chips may have been ...

TAIPEI (Taiwan News) — Global Unichip Corporation announced Thursday the first universal chiplet interconnect express ...

Celestial AI Inc., a startup that develops optical technology for linking chips, has raised $250 million in funding at a $2.5 ...

Nvidia (NASDAQ:NVDA) has had an underwhelming start to 2025, as the AI chip giant grapples with a mix of unfavorable macro developments and ...

SEOUL, March 12 (Yonhap) -- Chip giants Samsung Electronics Co. and SK hynix Inc. will showcase their latest advancements in ...

Samsung reports first broad market share decline in a decade Company acknowledges foundry yield struggles for first time ...

Samsung Electronics is set to hold its annual general meeting for its 5.2 million shareholders on March 19, when it plans to ...