As artificial intelligence creates new markets across industries, it is also fueling growth for Small Outline Compression Attached Memory Modules (SOCAMM), an emerging technology often described as ...

Probe Cards help FormFactor to serve customers’ design layout and electrical test requirements ... The expected sequential decline in demand for non-HBM DRAM probe cards and systems further ...

Key HBM Gen2 PHY product highlights include support for DRAM 2, 4 and 8 stack height ... Additional features include a flexible delivery of the IP core (works with ASIC/ SoC layout requirements), 8 ...

Surpassing Samsung in DRAM market share for the first time in its 40-year history can be attributed mainly to SK Hynix's ...

SK hynix continues to dominate the DRAM business, with the South Korean memory leader hitting 'phenomenal' yield rates with ...

SK hynix begins HBM production expansion: M10F fab re-purposing in operation, aims for 160,000 to 170,000 units per month in ...

But it's the last part people are taking for granted. It's correct to believe if it weren't for HBM, DRAM would join its memory brethren NAND in the downcycle camp. After all, everything but the ...

HBM—essentially a 3D structure of vertically stacked DRAM dies on top of a logic die—relies on advanced packaging technologies like through silicon vias (TSVs) while using a silicon interposer for ...

The AI era's rapid expansion is supercharging DRAM needs, positioning AMAT well for long-term growth in memory fabrication equipment. The Company's leadership in HBM manufacturing, with a 50% ...