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SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

Sandisk wants to pack an extremely large amount of fast flash memory onto GPU accelerators. Large language models would thus ...

South Korean memory makers SK Hynix and Samsung Electronics both saw their exports of multi-chip packages (MCP) fall ...

Chinese AI startup DeepSeek has demonstrated a cost-effective approach to high-performance AI, potentially disrupting SK ...

Micron happens to be one of the few major suppliers of HBM chips, thereby allowing it to capitalize on the expanding AI ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

China's memory semiconductor industry leader Changxin Memory Technologies (CXMT) is expected to enter the highly technical high bandwidth memory (HBM) market following DRAM, causing tension for ...

Micron (NASDAQ:MU) remains well-positioned to capitalize on the AI boom, but near-term uncertainty reared its head again ...

The great sage of modern baseball, Yogi Berra, said, “It’s tough to make predictions, especially about the future.” His ...

Discover Micron's volatile stock trends, strong DRAM demand, and potential recovery by Q4 2025. Learn why NAND oversupply may ...