Bruker Corporation (Nasdaq: BRKR) today announced the shipment and installation of the 15th InSight WLI 3D optical metrology ...

AI-driven demand for High-Bandwidth Memory positions Micron as a key beneficiary of the ongoing digital transformation. Read ...

TSMC’s advanced CoWoS and SoIC lines have become the key bottleneck for AI memory bandwidth, giving the company commanding pricing power. The foundry is replicating this 3D packaging and wafer ...

A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure ...

A deep dive into AMD’s Instinct MI350 GPU—featuring CDNA 4, 288GB HBM3E, and 3D chiplets—designed to take on NVIDIA in the AI ...

SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its ...

SK Hynix has reportedly secured customized high-bandwidth memory (HBM) orders from Nvidia, Microsoft, and Broadcom, pulling ...

Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.

Lam Research outshines Taiwan Semiconductor Manufacturing with strong AI-driven demand, fewer risks and higher earnings growth expected in FY25.

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture ...

Innovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...