Synaptics releases its first Veros triple-combo Wi-Fi 7 SoCs, supporting Wi-Fi, Bluetooth, and Zigbee/Thread with Matter ...

Samsung Electronics and SK hynix are considering adopting hybrid bonding technology for next-generation high-bandwidth memory ...

AP Memory seeks to capitalize on robust HPC and AI chip demand AP Memory sees revenue, gross margin improve in 2Q24 Taiwan memory IC design houses gearing up for edge AI boom ...

The Trade-Adverse Trade Adviser: Once sidelined, President Trump’s counselor Peter Navarro has returned to Washington and quickly upended the global trading system.

Of course, the AI boom added more fuel to these fires. Ultra-fast high bandwidth memory (HBM) is particularly useful in the torrential data shuffling that goes into training large language models ...

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

On the memory side, the majority of demand is coming from DRAM and it is driven by the need to increase capacity in high bandwidth memory production. Notably, we are seeing heightened demand for ...

The Supreme Court and other appellate courts haven’t yet determined whether the law is being used legally, though the high court has given some direction on how migrants’ challenges to the act ...

Showcase your company news with guaranteed exposure both in print and online The Future of Bay Area Biotech: Searching For Answers The Small Business Leaders awards program honors the dedicated ...

Abstract: A 15-transistor (15T) SRAM cell based fully-digital CIM macro is proposed for AI accelerations. The CIM macro not only supports simultaneous read + write + MAC operations, but also supports ...