Abstract: A comprehensive and integrated package stress model is established for QFN (Quad Flat Non-lead) packages with consideration of the effects of moisture diffusion, heat transfer, ...
To touch grass, venture outdoors and take a break from doom-and-gloom news, what can one do to pass the time without a smartphone? Perhaps they can take a peek into the infinitesimal world outside ...
Interesting Engineering on MSN
Thermometer smaller than ant’s antenna detects computer chip’s temperature in seconds
Researchers at Penn State in the US have developed a microscopic, 2D-material-based thermometer designed ...
Leeron is a New York-based writer who specializes in covering technology for small and mid-sized businesses. Her work has been featured in publications including Bankrate, Quartz, the Village Voice, ...
Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package
Abstract: For evaluating the hygro-thermo-mechanical reliability of fan-out (FO) wafer-level package, a coupled-field finite element (FE) model was developed to evaluate the moisture concentration and ...
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