The next question is, have DRAM and NAND prices actually recovered from ... DDR4 to DDR5 is an example, as it has two new logic components that DDR4 doesn't have. This adds to the costs of DDR5 ...

Lam Research is poised for long-term growth due to the increasing demand for 3D NAND, DRAM, and logic chips driven by AI adoption. Regardless of concerns over potential revenue loss from China ...

Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

FormFactor (FORM) is a $2.5 billion OEM of automated wafer probe cards and other testing devices used in the back-end portion of the semiconductor manufacturing process. FORM serves the ...

Ahead of the wafer fab equipment group’s earnings, Morgan Stanley upgraded KLA Corp. (KLAC) to Overweight as the firm expects the company to ...

Chinese 3D NAND and DRAM makers have been procuring new equipment ... in mind that the company produces NAND memory array and NAND logic using different process technologies on two different ...

Growth is driven by the increasing integration of artificial intelligence (AI), which is driving up the silicon content ...

Looking ahead, Lam expects NAND SAM to grow 1.8x, DRAM SAM 1.7x, and foundry/logic SAM 2x, supported by innovations like gate-all-around transistors and backside power distribution. With a strong ...

The increasing demand for 3D NAND, DRAM and logic chips also positions the company well for long-term growth. "Between DRAM and logic chips going 3D, LAM expects its serviceable addressable market ...

Analysts see steady earnings recovery ahead, but tariff, HBM headwinds remain Samsung Electronics on Tuesday said its earnings for the January–March period are expected to significantly exceed market ...