DDR3/DDR2/LPDDR2 COMBO interface for DRAM application;; SMIC 65nm Logic Low Leakage 1P10M Salicide 1.2V/1.8V/2.5V Process; ; Cell Size (Width * height) 40um * 270um with DUP stagger bonding ... HD ...
This includes high-capacity RDIMMs, LP DRAM for data centers, and enterprise SSDs. However, despite the positive outlook in these areas, the overall sentiment suggests that there might be better ...
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