Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology.

Manufacturers of most high-reliability microelectronics products are still exempt from the requirement to eliminate Pb from their soldering process, and neither their components nor their printed ...

Aligning the stencil over the board, we’ll tape that down, apply a blob of solder paste and spread it over. We’ll carefully remove it, revealing the coated pads. Let’s do the same for the LED ring ...

The advancement of miniaturization in package and board level assembly has been substantially accelerated by the growth of the Internet of Things and 5G. As the industry moves to smaller devices and ...