The company compares its 3D X-DRAM density to the current 0a-node planar DRAM’s 48GB and claims to reach 512GB, but the ...

Montage Technology is a global fabless semiconductor design company specializing in data processing and interconnect chip ...

T1C and 3T0C designs combine performance of DRAM with manufacturability of NAND, enabling cost-effective, high-yield ...

Computex AMD aims to extend its lead over Intel in the high-end desktop (HEDT) and workstation arenas with its 9000-series ...

in-memory computing, and next-gen DRAM and HBM applications; proof-of-concept test chips expected in 2026 Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026 ...

Expedera launches its Origin Evolution NPU IP, bringing hardware acceleration to meet the computational demands of running ...

Axiado Corporation, a leading AI-driven, hardware-anchored platform security solutions company, today announced the next-generation Trusted Control/Compute Unit (TCU), the new Axiado AX3080—the ...

These innovations underscore Silicon Motion's leadership in designing flexible, energy-efficient, high-performance SSD solutions for AI PCs, gaming systems, and portable devices. One of the key ...

Gary Dickerson; President, Chief Executive Officer, Director; Applied Materials Inc Brice Hill; Senior Vice President, Chief Financial Officer and Global Information Services; Applied Materials Inc ...