Detailed price information for Micron Technology (MU-Q) from The Globe and Mail including charting and trades.

Lam Research delivered strong March quarter results, with revenue growth near three-year highs. Read more on LRCX stock here ...

HBM roadmap teases HBM4, HBM5, HBM6, HBM7, HBM8 with HBM7 dropping by 2035 with new AI GPUs using 6.1TB of HBM7 and 15,000W ...

3D X-DRAM technology will bring bigger, faster memory by 2026, but there's no way these 512GB modules will sell to consumers News By Efosa Udinmwen published 21 May 2025 ...

Dynamic Random Access Memory (DRAM) serves as the backbone of modern computing, ... Fig. 4: A cross-section of the device simulation structure and metal gate work-function split conditions. Key ...

Sandisk's 3D Matrix Memory offers DRAM-like performance with four times the capacity at half the price, developed in collaboration with IMEC.

So at your left, there is a cross section of our latest generation etcher, a couple of unique capabilities in that generally, ... And actually look at the memory side, NAND and DRAM.

These metrics did not degrade after the DRAM-specific anneal. Flavors with taller fins (with up to 80-nm height) have also been developed, with improved threshold voltage mismatch and area gain.

Samsung has reportedly ordered equipment for 1c DRAM mass production, a critical part of HBM4 memory and its competitiveness with SK hynix.