Applied Materials AMAT is benefiting from rising demand for AI infrastructure, with its Logic and DRAM businesses gaining ...

NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the latest advancement in its groundbreaking 3D X-DRAM technology family ...

CXMT Corp., China's top domestic DRAM manufacturer, has initiated its IPO process, signaling a key step in the nation's pursuit of semiconductor independence. On July 7, 2025, China's securities ...

Samsung Electronics faces a pivotal moment in the AI chip market, battling weak profits, delayed HBM shipments, and U.S.

Memory and storage provider Micron Technology's stock surged over 37% due to strong demand for its memory chips, particularly ...

NEO Semiconductor’s push into 3D X-DRAM memory marks an ambitious attempt to rethink DRAM design for the AI and high-performance computing era. While the promises - stacked layers, ...

Prices of benchmark 8-gigabit DDR4 modules have doubled over the past month following a Taiwanese media report that leading ...

Samsung's thrust into 1c DRAM development is because it has fallen behind massively in the HBM semiconductor market against fellow South Korean memory rival SK hynix, and US-based Micron. 1c DRAM ...

From leadership changes at legacy semiconductor companies to wishy washy policy around chip exports, a lot has happened already.

Micron Technology has announced plans to invest approximately $200 billion in semiconductor manufacturing and research and development efforts in the U.S. as part of a push to improve domestic ...