SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

James reaffirmed their positive outlook on Micron Technology (NASDAQ:MU) shares, maintaining an Outperform rating and a $120.00 price target. According to InvestingPro data, Micron, a prominent player ...

Lee Jae-Yong, chairman of Samsung Electronics, has been acquitted in the appeals trial following the first trial on the ...

We recently compiled a list of the 10 AI Stocks on Analysts’ Radars. In this article, we are going to take a look at where KLA Corp. (NASDAQ:KLAC) stands against the other AI stocks. Despite DeepSeek ...

New Delhi, Jan. 31, 2025 (GLOBE NEWSWIRE) -- The global high bandwidth memory market was valued at US$ 501.0 million in 2024 and is expected to reach US$ 5,810.5 million by 2033, at a CAGR of 31.3% ...

New Delhi, Jan. 31, 2025 (GLOBE NEWSWIRE) -- The global high bandwidth memory market was valued at US$ 501.0 million in 2024 and is expected to reach US$ 5,810.5 million by 2033, at a CAGR of 31.3 ...

However, SK Hynix has surpassed Samsung in the area of “high bandwidth memory,” which is a new kind of DRAM where the chips are stacked vertically to save space and reduce power consumption.

Stop calling and asking questions. I can’t trust Samsung Electronics’ high-bandwidth memory (HBM) products and engineers. We cannot trust and do business with them because senior executives ...

There's a clear and pressing need for a new approach in the area of memory characterization, with the following requirements: First, the new solution must offer high productivity, even for large ...