SK Hynix Inc., the leading global high-bandwidth memory (HBM) chip provider, has moved faster than its rivals in the ...

Cadence HBM4 IP offers a PHY and a high-performance controller as a complete memory subsystem solution with lowest area and ...

JEDEC Solid State Technology Association, developer of standards for the microelectronics industry, today announced the ...

Cadence Design Systems, Inc. CDNS recently launched an HBM4 memory IP solution, which delivers an impressive 12.8Gbps data ...

Cadence announced the industry’s fastest HBM4 12.8Gbps memory IP solution, which meets the increasingly higher memory ...

JEDEC announced the publication of the HBM4 DRAM standard, delivering higher bandwidth, efficiency, and capacity for AI and ...

The NVIDIA Blackwell HGX B200 platform represents a significant leap forward in AI and HPC performance. TechInsights' teardown reveals that the platform leverages SK hynix's latest HBM3E memory ...

Ottawa tech firm’s initial findings reveal high-bandwidth memory provider and advanced packaging design architecture ...

At its GTC event in March, Nvidia unveiled the B300 and GB300 AI accelerators, both scheduled for a mid-2025 release. The GB300, featuring significantly higher performance and power consumption ...

Samsung is a supplier of HBM (high-bandwidth memory) chips, which is a key DRAM technology for the development of AI-focused hardware, such as NVIDIA’s AI chips. Samsung just lost its top spot ...

To our eye, the combination of chips looks a little bit bigger than the reticle limit. There are eight banks of HBM memory, four on each side and presumably HBM3E if it is shipping this year. That ...