With a sheer mass of Ascend 910C accelerators, Huawei is building servers that are said to be faster than Nvidia's Blackwell ...

Huawei to ship its Ascend 910C AI chip in volume, offering a domestic alternative to Nvidia hardware restricted by US export ...

The FPGA combines HBM with DDR5 and LPDDR5 support, enabling memory bandwidth and efficiency for AI and video processing ...

China's leading DRAM supplier, will dramatically expand its output in 2025—far surpassing previous expectations. If current ...

Leveraging optical interconnects and scale, Huawei's new CloudMatrix 384 AI cluster surpasses Nvidia's GB200 performance but ...

Huawei unveils AI CloudMatrix 384 system based on 384 Ascend 910C processors that can beat Nvidia's GB200 NVL72 in ...

Hyundai Motor Securities recently projected in a report that 'given that Chinese DRAM companies are developing HBM3 (fourth generation HBM) and HBM2E (third generation HBM), Chinese HBM is expected to ...

According to industry sources on the 25th, ... Samsung Electronics reduces HBM2E output to focus on next-generation memory products Samsung Electronics is gradually reducing the production of ...

North America (US, Canada, Mexico), Europe (Eastern Europe [Poland, Romania, Hungary, Turkey, Rest of Eastern Europe] Western Europe [Germany, France, UK, Italy ...

Agilex 7 FPGA M-Series features a hardened memory Network-on-Chip (NoC) interface that delivers the industry’s highest memory bandwidth, up to 1 TBps, using in-package HBM2E and hardened DDR5/LPDDR5 ...

The series features a hardened memory Network-on-Chip (NoC) interface that delivers a memory bandwidth of up to 1 TBps, using in-package HBM2E and hardened DDR5/LPDDR5 memory controllers. The ...

Agilex 7 FPGA M-Series features a hardened memory Network-on-Chip (NoC) interface that delivers the industry’s highest memory bandwidth, up to 1 TBps, using in-package HBM2E and hardened DDR5 ...