SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash ...

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Deep Space Optical Communication (DSOC) uses near-infrared lasers for high-bandwidth, low-power, and efficient communication ...

At the same event, Sandisk also unveiled its High Bandwidth Flash (HBF) concept which is taking aim at HBM by augmenting it with NAND flash to cater to AI inference workloads. Sandisk’s key ...

Apple has announced the M3 Ultra, which the tech giant says is “the highest-performing chip it has ever created.” It offers ...

The new Mac Studio with M3 Ultra and M4 Max options have just been unveiled by Apple. Here's everything you need to know ...

Advanced packaging technologies, such as 2.5D and 3D integration, allow for the stacking of memory and logic chips. Stacking ...

Valens Semiconductor, RGo Robotics, and CHERRY Embedded Solutions have joined forces to advance AI-driven robotic systems. The integration of MIPI A-PHY chipsets and RGo's Perception Engine enables ...

Optimized for the low-latency and high-bandwidth memory applications, the HBM Gen2 PHY delivers maximum performance and flexibility HBM is a high-performance memory that features reduced power ...