SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

Worldwide semiconductor revenue in 2024 totaled $626 billion, an increase of 18.1% from 2023, according to preliminary ...

Micron (NASDAQ:MU) remains well-positioned to capitalize on the AI boom, but near-term uncertainty reared its head again ...

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The great sage of modern baseball, Yogi Berra, said, “It’s tough to make predictions, especially about the future.” His ...

International Value Equity strategy which in USD returned -2.1%, compared to the +3.8% return of the EAFE and the +5.7% ...

Micron happens to be one of the few major suppliers of HBM chips, thereby allowing it to capitalize on the expanding AI ...

OpenAI is working with TSMC to design its first in-house AI chips, aiming to cut dependency on Nvidia and control computing costs.

According to a Reuters story, This year, according to reports, OpenAI intends to produce its first proprietary artificial ...

China’s leading memory chipmaker, ChangXin Memory Technologies (CXMT), is pushing into the high-bandwidth memory (HBM) market, a move that could disrupt South Korea’s dominance in advanced ...