JEDEC, the international semiconductor standards organization, has unveiled the High Bandwidth Memory 4 (HBM4) specification—a... Save my User ID and Password Some subscribers prefer to save ...

The new segment, called "cloud memory business unit", will focus on products used by hyperscalers, as well as its high-bandwidth memory (HBM) chips that help perform data-intensive AI tasks quickly.

The new segment will be called “cloud memory business unit,” and will focus on products used by hyperscalers and high-bandwidth memory (HBM) chips to aid data-intensive AI tasks. Overall ...

aims to redefine the competitive landscape in artificial intelligence memory chips with plans to introduce vertically stacked 3D HBM from its fifth-generation high-bandwidth memory (HBM5). The South ...

The JEDEC released Standard 270-4, supplying high bandwidth memory (HBM) makers with a complete specification for what will likely be a massively lucrative product for the usual suspects ...

As researchers prepare for their presentations, we are highlighting some of the scheduled ... 8 A Fast and Robust VSaf AAV Platform Technology for Producing High Quality and Yield of AAV Vectors for ...

Put simply, summer slides have never been better. Classic sport styles like the Nike Benassi and adidas adilette are supplemented by more experimental and high-fashion designs from the likes of ...

HBM4 introduces numerous improvements to the prior version of the standard, including: “High performance computing platforms are evolving rapidly and require innovation in memory bandwidth and ...

SkyeChip’s HBM3 IP consists of a PHY and memory controller optimized for Samsung SF4X process to support the HBM3 memory standard (JESD238A) operating at up to 9.6 Gbps/pin. The HBM3 IP is designed ...

Samsung Electronics' institutional sector has decided to transfer some personnel from the foundry (semiconductor contract manufacturing) division to the high bandwidth memory (HBM) business ...