This is true 3D integration ... have to reconsider the activity factor within the logic.” Going vertical has other benefits. “By going vertical, going across different die, we can use different memory ...

Players take turns dropping coloured discs into a vertical ... attention, logic and reasoning, planning, speed, problem solving, sensory motor integration, short term and working memory and ...

This vertical stacking approach eliminates ... This future technology will enable the integration of two layers of logic chips, HBM memory (on interposer), and even co-package optics (CPOs).

“We are excited to achieve this milestone in collaboration with our 3D integration partners including memory suppliers and IC manufacturers. This test-chip is a significant step for the introduction ...