TL;DR: SK hynix unveiled next-gen HBM4 memory with up to 16-Hi stacks ... featuring advanced MR-MUF and TSV tech for high-layer integration, alongside high-speed RDIMM and MRDIMM server modules ...

Manufacturing-Friendly – Uses a modified 3D NAND process, with minimal changes, enabling full scalability and rapid integration into existing ... for high-density DRAM, in-memory computing, hybrid ...

Plans include leveraging advanced product lines like Vertical Wire and Thermo-Compression solutions to capitalize on memory and logic market opportunities. Revenue for Q2 2025 was $162 million ...

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

NOVeA is the industry's first commercially available embedded in system reprogrammable non- volatile memory (NVM) that is manufactured on a standard 0.18um CMOS logic process without ... that indicate ...

E-beam inspection’s notorious sensitivity-throughput tradeoff has made comprehensive defect coverage with e-beam at these advanced nodes especially problematic. For Intel’s 18A logic node (~1.8nm ...

This will enable the integration of 12 or more high-bandwidth memory stacks into a single ... are expected to provide five times the vertical power density of traditional solutions. In addition to ...

TSMC (TWSE: 2330, NYSE: TSM) today unveiled its next cutting-edge logic process technology, A14, at the Company’s North America Technology Symposium. Representing a significant advancement from TSMC’s ...

In terms of customer segments, revenue was led by foundry followed by logic and ... 2 technology or vertical channel transistor, VCT. This involves not only a shrinking of the memory cell, but ...