LG Innotek (CEO Moon Hyuksoo) announced on July 3rd that it successfully developed and started mass-producing the world's first copper post (Cu-Post) technology, which is applicable high-value-added ...

Murata’s ultra-small Type 2NR multi-protocol wireless module delivers advanced performance, long battery life, and simplified ...

Raspberry Pi has unveiled the RMC20452T, its debut radio module designed to provide easy-to-integrate Wi-Fi and Bluetooth ...

Navitas' GaN IC portfolio is expected to use Powerchip’s 200mm in Fab 8B, located in Zhunan Science Park, Taiwan. The fab has ...

Better utilizing the resources available to us is one of technology’s greatest strengths. Whether it's getting more corn out ...

MDA Space leverages satellite information service to deliver maritime services to DFO's Dark Vessel Detection program ...

Reflections from a recent panel discussion at DAC, The Chips to Systems Conference held at Moscone West on the CHIPS Act's impact on the design ecosystem ...

Flip chip wire bond is a modern way to connect chips, turning them upside down for better performance. This technology makes ...