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  1. Vertical power devices with thick GaN layers on sapphire

  2. Realising high-performance sensors with heterogeneous integration

  3. DARPA awards $3M for heterogenous integration research

  4. MicroLED chip revenue to reach $489.5m by 2028 - News

  5. Clas-SiC expands technology in its stride - News

  6. Advancing GaN power devices with ammonia MBE

  7. Nexperia: Expanding GaN and SiC operations - News

  8. Aixtron opens innovation centre - News

  9. Smartkem signs agreement with FlexiIC - News

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